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  • image of 逻辑门阵列的配置结构>XC1701LPDG8I
  • image of 逻辑门阵列的配置结构>XC1701LPDG8I
： XC1701LPDG8I
： 逻辑门阵列的配置结构
： Xilinx Inc.
： Through Hole
： -
： 8-DIP (0.300, 7.62mm)
： YES

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image of 逻辑门阵列的配置结构>XC1701LPDG8I
image of 逻辑门阵列的配置结构>XC1701LPDG8I
：
XC1701LPDG8I
：
逻辑门阵列的配置结构
：
Xilinx Inc.
：
Through Hole
：
-
：
8-DIP (0.300, 7.62mm)
：
YES
TYPEDESCRIPTION
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature -40°C~85°C
Packaging Tube
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC1701L
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1Mb
Operating Mode SYNCHRONOUS
Clock Frequency 15MHz
Supply Current-Max 0.01mA
Organization 1MX1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Length 9.3599mm
Height Seated (Max) 4.5974mm
Width 7.62mm
RoHS Status RoHS Compliant
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