• image of 金属氧化物半导体场效应晶体管阵列>SIZ910DT-T1-GE3
  • image of 金属氧化物半导体场效应晶体管阵列>SIZ910DT-T1-GE3
SIZ910DT-T1-GE3
金属氧化物半导体场效应晶体管阵列
Vishay Siliconix
SIZ910DT-T1-GE3
-
8-PowerWDFN
YES

captcha
image of 金属氧化物半导体场效应晶体管阵列>SIZ910DT-T1-GE3
image of 金属氧化物半导体场效应晶体管阵列>SIZ910DT-T1-GE3
SIZ910DT-T1-GE3
金属氧化物半导体场效应晶体管阵列
Vishay Siliconix
SIZ910DT-T1-GE3
-
8-PowerWDFN
YES
TYPEDESCRIPTION
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerWDFN
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Digi-Reel®
Series TrenchFET®
Published 2015
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Max Power Dissipation 100W
Base Part Number SIZ910
Pin Count 8
JESD-30 Code R-PDSO-N6
Number of Elements 2
Number of Channels 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Case Connection DRAIN SOURCE
Power - Max 48W 100W
FET Type 2 N-Channel (Half Bridge)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 5.8m Ω @ 20A, 10V
Vgs(th) (Max) @ Id 2.2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1500pF @ 15V
Gate Charge (Qg) (Max) @ Vgs 40nC @ 10V
Rise Time 35ns
Drain to Source Voltage (Vdss) 30V
Fall Time (Typ) 12 ns
Continuous Drain Current (ID) 40A
Gate to Source Voltage (Vgs) 20V
Drain-source On Resistance-Max 0.0075Ohm
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 100A
Avalanche Energy Rating (Eas) 31 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Height 750μm
Length 6mm
Width 5mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
1.jpg
 原装正品       每颗芯片都来自原厂


2.jpg
       

 主要产品       只生厂材料


3.jpg
        

 现货库存       只生产原材料

4.jpg       

原装库存Bom 单价格实惠


+86-13723477211

sales@fuchaoic.com

点击这里给我发消息
0