• image of 非焊接面包板>PA0027C
  • image of 非焊接面包板>PA0027C
PA0027C
Solderless Breadboards
Chip Quik, Inc.
PA0027C datashe
-
-
YES

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image of 非焊接面包板>PA0027C
image of 非焊接面包板>PA0027C
PA0027C
Solderless Breadboards
Chip Quik, Inc.
PA0027C datashe
-
-
YES
TYPEDESCRIPTION
Contact Material Gold
Material FR4 Epoxy Glass
Package Accepted MSOP, uMAX, uSOP
RoHS Details
Package Bulk
Base Product Number PA0027
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Size / Dimension 0.500 L x 0.400 W (12.70mm x 10.16mm)
Type uMAX-10/uSOP-10/MSOP-10 to DIP-10 SMT Adapter
Number of Positions 10
Pitch 0.020 (0.50mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 12.7 mm
Width 10.16 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
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 原装正品       每颗芯片都来自原厂


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 主要产品       只生厂材料


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 现货库存       只生产原材料

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