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  • image of 热垫>A17714-02
A17714-02
Thermal Pads
Laird Technologies - Thermal Materials
A17714-02 datas
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-
YES

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image of 热垫>A17714-02
image of 热垫>A17714-02
A17714-02
Thermal Pads
Laird Technologies - Thermal Materials
A17714-02 datas
-
-
YES
TYPEDESCRIPTION
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD400
Published 2018
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Blue
Adhesive Tacky - Both Sides
Outline 457.20mm x 457.20mm
Thermal Conductivity 4.0W/m-K
Thickness 0.0200 0.508mm
RoHS Status RoHS Compliant
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


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