: | A16367-41 |
---|---|
: | Thermal Pads |
: | Laird Technologies - Thermal Materials |
: | A16367-41 datas |
: | - |
: | - |
: | YES |
TYPE | DESCRIPTION |
Factory Lead Time | 3 Weeks |
Material | Non-Silicone, Boron Nitride Filled |
Shape | Square |
Series | Tflex™ SF600 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Gap Filler Pad, Sheet |
Color | Pink |
Outline | 228.60mm x 228.60mm |
Thermal Conductivity | 3.0W/m-K |
Thickness | 0.410 10.41mm |
RoHS Status | RoHS Compliant |
Orignal genuine | Each chip comes from the original factory |
| |
Main products | Only make original stock |
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Spot inventory | Only make original stock |
|
Original stock | Bom Distributio | Affordable Price |