• image of 热垫>A16367-41
  • image of 热垫>A16367-41
A16367-41
Thermal Pads
Laird Technologies - Thermal Materials
A16367-41 datas
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YES

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image of 热垫>A16367-41
image of 热垫>A16367-41
A16367-41
Thermal Pads
Laird Technologies - Thermal Materials
A16367-41 datas
-
-
YES
TYPEDESCRIPTION
Factory Lead Time 3 Weeks
Material Non-Silicone, Boron Nitride Filled
Shape Square
Series Tflex™ SF600
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Pink
Outline 228.60mm x 228.60mm
Thermal Conductivity 3.0W/m-K
Thickness 0.410 10.41mm
RoHS Status RoHS Compliant
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


+86-13723477211

sales@fuchaoic.com
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