: | A16366-02 |
---|---|
: | Thermal Pads |
: | Laird Technologies - Thermal Materials |
: | A16366-02 datas |
: | - |
: | - |
: | YES |
TYPE | DESCRIPTION |
Factory Lead Time | 4 Weeks |
Material | Non-Silicone, Boron Nitride Filled |
Shape | Rectangular |
Series | Tflex™ SF600 DF |
Published | 2012 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Gap Filler Pad, Sheet |
Color | Pink |
Adhesive | Tacky - One Side |
Outline | 431.80mm x 457.20mm |
Thermal Conductivity | 3.0W/m-K |
Thickness | 0.0200 0.508mm |
RoHS Status | RoHS Compliant |
Orignal genuine | Each chip comes from the original factory |
| |
Main products | Only make original stock |
| |
Spot inventory | Only make original stock |
|
Original stock | Bom Distributio | Affordable Price |