• image of 热垫>A16366-02
  • image of 热垫>A16366-02
A16366-02
Thermal Pads
Laird Technologies - Thermal Materials
A16366-02 datas
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-
YES

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image of 热垫>A16366-02
image of 热垫>A16366-02
A16366-02
Thermal Pads
Laird Technologies - Thermal Materials
A16366-02 datas
-
-
YES
TYPEDESCRIPTION
Factory Lead Time 4 Weeks
Material Non-Silicone, Boron Nitride Filled
Shape Rectangular
Series Tflex™ SF600 DF
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - One Side
Outline 431.80mm x 457.20mm
Thermal Conductivity 3.0W/m-K
Thickness 0.0200 0.508mm
RoHS Status RoHS Compliant
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


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