TYPE | DESCRIPTION |
Package / Case | FBGA |
Mounting Type | Surface Mount |
Surface Mount | YES |
Supplier Device Package | 256-FPBGA (17x17) |
Number of Terminals | 256 |
Mounting Style | SMD/SMT |
RoHS | Details |
Number of I/Os | 119 I/O |
Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 85 C |
Tradename | Fusion |
Package | Tray |
Base Product Number | M1AFS1500 |
Mfr | Microchip Technology |
Product Status | Active |
Package Shape | SQUARE |
Series | M1AFS1500 |
Packaging | Tray |
Operating Temperature | -40°C ~ 100°C (TJ) |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.39.00.01 |
Technology | CMOS |
Voltage - Supply | 1.425V ~ 1.575V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 1 mm |
Reach Compliance Code | compliant |
JESD-30 Code | S-PBGA-B256 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 1.5 V |
Temperature Grade | INDUSTRIAL |
Number of I/O | 119 |
Organization | 1500000 GATES |
Seated Height-Max | 1.7 mm |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Total RAM Bits | 276480 |
Number of Gates | 1500000 |
Speed Grade | STD |
Number of Equivalent Gates | 1500000 |
Height | 1.2 mm |
Length | 17 mm |
Width | 17 mm |