AFS250-1FG256 FPGAs_Electronic components_ Integrated circuit IC_ Semiconductor components_ Equipment procurement_ EIS LIMITED

TYPE	DESCRIPTION
Lifecycle Status	Production (Last Updated: 2 months ago)
Package / Case	FBGA
Surface Mount	YES
Mount	Surface Mount
Mounting Type	Surface Mount
Number of Pins	256
Supplier Device Package	256-FPBGA (17x17)
Weight	400.011771 mg
Number of Terminals	256
Mounting Style	SMD/SMT
RoHS	N
Number of I/Os	114 I/O
Minimum Operating Temperature	0 C
Maximum Operating Temperature	+ 70 C
Tradename	Fusion
Package Shape	SQUARE
Product Status	Active
Mfr	Microchip Technology
Base Product Number	AFS250
Package	Tray
Series	AFS250
Packaging	Tray
Operating Temperature	0°C ~ 85°C (TJ)
Terminal Finish	TIN LEAD/TIN LEAD SILVER
Max Operating Temperature	70 °C
Min Operating Temperature	0 °C
HTS Code	8542.39.00.01
Technology	CMOS
Voltage - Supply	1.425V ~ 1.575V
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	225
Terminal Pitch	1 mm
Reach Compliance Code	unknown
JESD-30 Code	S-PBGA-B256
Qualification Status	Not Qualified
Operating Supply Voltage	1.5 V
Temperature Grade	OTHER
Max Supply Voltage	1.575 V
Min Supply Voltage	1.425 V
Number of I/O	114
RAM Size	4.5 kB
Organization	6144 CLBS, 250000 GATES
Seated Height-Max	1.68 mm
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits	36864
Number of Gates	250000
Max Frequency	1.28205 GHz
Speed Grade	1
Number of Registers	6144
Number of CLBs	6144
Number of Equivalent Gates	250000
Height	1.2 mm
Length	17 mm
Width	17 mm
Radiation Hardening	No


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