• image of 内联内存模块插座>2-2013298-1
  • image of 内联内存模块插座>2-2013298-1
2-2013298-1
Inline Memory Module Sockets
TE Connectivity AMP Connectors
2-2013298-1 dat
-
-
YES

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image of 内联内存模块插座>2-2013298-1
image of 内联内存模块插座>2-2013298-1
2-2013298-1
Inline Memory Module Sockets
TE Connectivity AMP Connectors
2-2013298-1 dat
-
-
YES
TYPEDESCRIPTION
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Factory Lead Time 11 Weeks
Contact Plating Gold
Mount Surface Mount
Mounting Type Surface Mount, 25° Angle
Mounting Feature Reverse
Insulation Material Thermoplastic
Housing Material Thermoplastic
Packaging Tape & Reel (TR)
Published 2010
Feature Board Guide, Latches
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 204
Max Operating Temperature 185°C
Min Operating Temperature -67°C
Number of Rows 2
Pitch 609.6μm
Orientation Right Angle
Depth 26.5mm
Contact Finish Gold
Number of Contacts 204
Housing Color Black
Row Spacing 8.1788 mm
ELV Compliant
Max Current Rating 500mA
Connector Style SODIMM
Memory Type DDR3 SDRAM
Sealable No
Contact Current Rating 500mA
Circuit Application Power
Length 75.9mm
Contact Finish Thickness Flash
Stack Height 8.001mm
Radiation Hardening No
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


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