• image of 非焊接面包板>PA0032C
  • image of 非焊接面包板>PA0032C
PA0032C
Solderless Breadboards
Chip Quik, Inc.
PA0032C datashe
-
-
YES

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image of 非焊接面包板>PA0032C
image of 非焊接面包板>PA0032C
PA0032C
Solderless Breadboards
Chip Quik, Inc.
PA0032C datashe
-
-
YES
TYPEDESCRIPTION
Contact Material Gold
Material FR4 Epoxy Glass
Package Accepted TSSOP
RoHS Details
Package Bulk
Base Product Number PA0032
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Size / Dimension 0.400 L x 0.400 W (10.16mm x 10.16mm)
Type TSSOP-8 to DIP-8 SMT Adapter
Number of Positions 8
Pitch 0.026 (0.65mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 10.16 mm
Width 10.16 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
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