• image of 非焊接面包板>PA0009C
  • image of 非焊接面包板>PA0009C
PA0009C
Solderless Breadboards
Chip Quik, Inc.
PA0009C datashe
-
-
YES

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image of 非焊接面包板>PA0009C
image of 非焊接面包板>PA0009C
PA0009C
Solderless Breadboards
Chip Quik, Inc.
PA0009C datashe
-
-
YES
TYPEDESCRIPTION
Contact Material Gold
Material FR4 Epoxy Glass
Package Accepted SOIC
RoHS Details
Package Bulk
Base Product Number PA0009
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Size / Dimension 1.200 L x 0.700 W (30.48mm x 17.78mm)
Type SOIC-24 to DIP-24 SMT Adapter
Number of Positions 24
Pitch 0.050 (1.27mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 30.48 mm
Width 17.78 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
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