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OB3-LF
Solderless Breadboards
Twin Industries
OB3-LF datashee
-
-
YES

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image of 非焊接面包板>OB3-LF
image of 非焊接面包板>OB3-LF
OB3-LF
Solderless Breadboards
Twin Industries
OB3-LF datashee
-
-
YES
TYPEDESCRIPTION
Factory Lead Time 4 Weeks
Published 2017
Size / Dimension 6.70 x 3.00 170.2mmx76.2mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Distribution Strip (No Frame)
Number of Tie Points (Total) 90
Number of Distribution Buses 1
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


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