TYPE | DESCRIPTION |
ECCN (US) | EAR99 |
Module | DRAM Module |
Module Density | 1Gbyte |
Number of Chip per Module | 16 |
Chip Density (bit) | 512M |
Data Bus Width (bit) | 64 |
Maximum Clock Rate (MHz) | 667 |
Chip Configuration | 64Mx8 |
Chip Package Type | FBGA |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.9 |
ECC Support | No |
Number of Ranks | Single |
CAS Latency | 5 |
SPD EEPROM Support | Yes |
Standard Package Name | DIM |
Supplier Package | SODIMM |
Mounting | Socket |
Package Height | 30 |
Package Length | 67.6 |
PCB changed | 200 |
Lead Shape | No Lead |
Part Status | Active |
Pin Count | 200 |
Organization | 128Mx64 |
Self Refresh | No |
Module Type | 200SODIMM |
RoHS Status | RoHS Compliant |