• image of 接线板>PA0209
  • image of 接线板>PA0209
PA0209
Breakout Boards
Chip Quik Inc.
PA0209 datashee
-
-
YES

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image of 接线板>PA0209
image of 接线板>PA0209
PA0209
Breakout Boards
Chip Quik Inc.
PA0209 datashee
-
-
YES
TYPEDESCRIPTION
Material FR4 Epoxy Glass
Package Accepted TSOP
Series Proto-Advantage
Published 2009
Size / Dimension 1.000 x 2.500 25.40mmx63.50mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 50
Pitch 0.031 0.80mm
Proto Board Type SMD to DIP
Board Thickness 0.062 1.57mm 1/16
RoHS Status ROHS3 Compliant
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


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